薄層(ceng)電動(dong)點(dian)樣儀(yi)用途(tu)
DP -I電(dian)動(dong)點(dian)樣儀(yi)是(shi)我(wo)廠推出(chu)的系(xi)列薄層(ceng)分(fen)析(xi)設(she)備(bei)，該儀(yi)器(qi)具(ju)有不銹鋼(gang)加熱(re)平臺. 0-110℃自(zi)動(dong)控(kong)溫(wen), 加速點(dian)樣溶(rong)劑揮發，使(shi)斑(ban)點(dian)直(zhi)徑(jing)縮小(xiao)壹半(ban),提高(gao)分(fen)離效(xiao)果.電動(dong)控(kong)制(zhi)壓(ya)針點樣,行(xing)程60毫(hao)米(mi),克服點樣抖(dou)動(dong)產(chan)生(sheng),薄層(ceng)凹陷,提高(gao)板(ban)效(xiao).

 薄層(ceng)電動(dong)點(dian)樣儀(yi)用途(tu) 型號(hao)：DP-I/II

DP-I

  加速點(dian)樣溶(rong)劑揮發，縮小(xiao)斑(ban)點直徑,具(ju)有不銹鋼(gang)加熱(re)平臺.IA型0-110℃自動(dong)控(kong)溫(wen),IB型0-200℃溫(wen)控(kong),數(shu)碼顯(xian)示使(shi)斑(ban)點(dian)直(zhi)徑(jing)縮小(xiao)壹半(ban),提高(gao)分(fen)離效(xiao)果.電動(dong)控(kong)制(zhi)壓(ya)針點樣,行(xing)程60毫(hao)米(mi),克服點樣抖(dou)動(dong)產(chan)生(sheng),薄層(ceng)凹陷,提高(gao)板(ban)效(xiao).

DP-II  

 具(ju)有不銹鋼(gang)加熱(re)平臺,溫(wen)度可(ke)調(tiao)0-200℃Ⅱ型 0－200℃數(shu)顯(xian)可(ke)調(tiao)控(kong)溫(wen)。既(ji)可(ke)間息點(dian)樣，又(you)可(ke)連續(xu)點(dian)樣，使(shi)分(fen)析(xi)工作(zuo)方便(bian)。加熱(re)平臺可(ke)左右(you)電動(dong)，行(xing)程160mm。

薄層(ceng)電動(dong)點(dian)樣儀(yi)用途(tu)

 DP -I電(dian)動(dong)點(dian)樣儀(yi)是(shi)我(wo)廠推出(chu)的系(xi)列薄層(ceng)分(fen)析(xi)設(she)備(bei)，該儀(yi)器(qi)具(ju)有不銹鋼(gang)加熱(re)平臺. 0-110℃自(zi)動(dong)控(kong)溫(wen), 加速點(dian)樣溶(rong)劑揮發，使(shi)斑(ban)點(dian)直(zhi)徑(jing)縮小(xiao)壹半(ban),提高(gao)分(fen)離效(xiao)果.電動(dong)控(kong)制(zhi)壓(ya)針點樣,行(xing)程60毫(hao)米(mi),克服點樣抖(dou)動(dong)產(chan)生(sheng),薄層(ceng)凹陷,提高(gao)板(ban)效(xiao).

儀(yi)器(qi)參數(shu)

點(dian)樣方式(shi)：接觸式點樣

點(dian)樣形(xing)狀(zhuang)：圓(yuan)點(dian)狀(zhuang)

點(dian)樣平臺：大可(ke)放(fang)200*200mm薄層(ceng)板(ban)

平臺加熱(re)功(gong)率：600W

加熱(re)臺控(kong)溫(wen)：0—110℃ 普(pu)通可(ke)調(tiao)控(kong)溫(wen)

進(jin)樣針規(gui)格：配(pei)10,50 ul進(jin)樣針,

點(dian)樣準確度：於(yu)1.0%

點(dian)樣重(zhong)現(xian)性(xing)：於(yu)1. 5%

取(qu)樣：點(dian)樣針直接(jie)吸(xi)樣，操(cao)控(kong)簡便(bian)，避(bi)免(mian)產生(sheng)氣泡(pao)影響點(dian)樣精(jing)度

清(qing)洗(xi)：可(ke)將點樣針取下(xia)直接(jie)清洗(xi)，操(cao)作(zuo)方便(bian)，

電(dian)源(yuan)、功(gong)率：220V±10％， 50-60HZ， 630W

儀(yi)器(qi)特(te)點(dian)

1.配(pei)有不銹鋼(gang)的加熱(re)平臺，在(zai)溫(wen)度低(di)時(shi)，可(ke)加熱(re)點樣，由(you)此(ci)加快(kuai)樣品(pin)溶(rong)劑的揮發，降低(di)樣品(pin)斑(ban)點的擴(kuo)散(san)，使(shi)斑(ban)點(dian)細(xi)小(xiao).

2.裝(zhuang)有電(dian)動(dong)點(dian)樣座(zuo)，以控(kong)制(zhi)電(dian)機自動(dong)下(xia)壓(ya)針桿，克服(fu)手(shou)動(dong)點(dian)樣抖(dou)動(dong)。避(bi)免(mian)破壞層(ceng)析(xi)薄層(ceng)，不會(hui)產(chan)生(sheng)樣品(pin)斑(ban)點凹陷現(xian)象.